Volume : VI, Issue : IV, April - 2017
A Review Paper based On high speed OnChip VLSI Optical Interconnection Network
Abhishek Sharma, Sudhir Kumar Sharma, Pramod Sharma
Abstract :
Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately solve the communication problem and obtain high–performance integrated circuits. In this paper, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to fulfill the requirements of silicon–based ICs must satisfy to successfully perform copper electrical interconnects (IEs). Interconnect has become a primary bottleneck in the integrated circuit design process. As CMOS technology is scaled, the design
requirements of delay, power, bandwidth, and noise due to the on–chip interconnects have become more stringent. New design challenges are continuously emerging, such as delay uncertainty induced by process and environmental variations. It has become increasingly difficult for conventional copper interconnect to satisfy these design requirements. On–chip optical interconnect has been considered as a potential substitute for electrical interconnect.
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DOI : 10.36106/ijsr
Cite This Article:
Abhishek Sharma, Sudhir Kumar Sharma, Pramod Sharma, A Review Paper based On high speed OnChip VLSI Optical Interconnection Network, INTERNATIONAL JOURNAL OF SCIENTIFIC RESEARCH : VOLUME-6 | ISSUE-4 | APRIL‾2017
Number of Downloads : 629
References :
Abhishek Sharma, Sudhir Kumar Sharma, Pramod Sharma, A Review Paper based On high speed OnChip VLSI Optical Interconnection Network, INTERNATIONAL JOURNAL OF SCIENTIFIC RESEARCH : VOLUME-6 | ISSUE-4 | APRIL‾2017
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