Investigation of Tool Life & Surface  Roughness During Single Point Diamond  Turning of Silicon.

Karanvir Singh; Rahul O Vaishya; Harinderpal Singh; Vinod Mishra; Ramagopal V Sarepaka

Volume : II, Issue : VI, June - 2013

Investigation of Tool Life & Surface Roughness During Single Point Diamond Turning of Silicon.

Karanvir Singh, Rahul O Vaishya, Harinderpal Singh , Vinod Mishra, Ramagopal V Sarepaka

Abstract :

In the present study investigation was done to analyze the tool life by analyzing the change in surface roughness with time during machining of silicon (infrared crystal) at optimized parameters with a single crystal diamond tool. Silicon has low mass density, low cost & low coefficient of thermal expansion. Due to these properties it is used in microelectro, micro-mechanical & weight sensitive infrared applications where surface roughness is a major criteria for the acceptance of the faicated part. A contact type mechanical profilometer was used to measure the surface roughness of silicon.